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Prof. Gary CHAN Shares Smart City Research on AIoT 3D Reconstruction at E&M I&T Day 2026 

Overcoming the limitations of traditional hardware-heavy LiDAR modeling through AIoT and crowdsourced data 

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[9 June 2026] The GREAT Smart Cities Institute (GSCI) at The Hong Kong University of Science and Technology (HKUST) participated in the recent E&M I&T Day 2026, held at the Hong Kong Science Park. Hosted by the Electrical and Mechanical Services Department (EMSD), the event served as a premier platform for industry leaders and researchers to discuss the future of smart city research and urban innovation.

Prof. Gary Chan presenting his research, "AIoT 3D Reconstruction for Large Indoor Space," to delegates at the E&M I&T Day 2026 seminar.
Prof. Gary Chan presenting his research, "AIoT 3D Reconstruction for Large Indoor Space," to delegates at the E&M I&T Day 2026 seminar.

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Addressing Challenges in Indoor 3D Modeling

During the seminar, Prof. Gary Chan, Associate Director of the GSCI, shared his latest findings on "AIoT 3D Reconstruction for Large Indoor Space." As the demand for high-fidelity spatial data grows, traditional 3D modeling methods have historically been constrained by high costs and the need for specialized, labor-intensive hardware like LiDAR. Prof. Chan discussed an alternative approach that utilizes crowdsourced data from everyday smartphones, combined with AIoT multimodal signals and Generative AI to "inpaint" blind 3D areas. This smart city research offers a pathway toward more efficient, large-scale 3D modeling for complex indoor environments

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Transformative Applications for Smart Cities

The seminar explored how this technology could potentially support applications in various sectors, including: 

  • Construction and Facility Management: Supporting Building Information Modeling (BIM) and construction coordination. 
  • Heritage Preservation: Streamlining the documentation of historic sites. 
  • Operational Efficiency: Enabling precision robotic navigation and real-time emergency response planning. 

We extend our thanks to the EMSD for the invitation to share these research insights and to the Hong Kong Science and Technology Parks Corporation (HKSTP) for hosting the event. 

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